IC & Sensor Packaging Technology Expo
20th–22nd January 2021
Tokyo Big Sight

Gathers Together Packaging Technologies for IC & Sensor Devices

Overview

A gathering of all types of products, technologies and services that contribute to the miniaturization and thinning of cutting-edge devices such as semiconductors, LED, power devices, sensors and MEMS. *Exhibitor and visitor totals are for ELECTRONIC COMPONENTS & MATERIALS EXPO, ELECTROTEST JAPAN, FINE PROCESS TECHNOLOGY EXPO, IC & Sensor Packaging Technology Expo, INTERNEPCON JAPAN and PWB Expo combined.

Venue City
Tokyo
Industry Sector
Electronics & Electrical Engineering
Frequency
Annual
Event Edition Number
20
Total Exhibitors
920
Total Visitors
30000

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